JPS635238Y2 - - Google Patents

Info

Publication number
JPS635238Y2
JPS635238Y2 JP1981117854U JP11785481U JPS635238Y2 JP S635238 Y2 JPS635238 Y2 JP S635238Y2 JP 1981117854 U JP1981117854 U JP 1981117854U JP 11785481 U JP11785481 U JP 11785481U JP S635238 Y2 JPS635238 Y2 JP S635238Y2
Authority
JP
Japan
Prior art keywords
metallized
lead
layer
insulating substrate
metallized layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981117854U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5822741U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981117854U priority Critical patent/JPS5822741U/ja
Publication of JPS5822741U publication Critical patent/JPS5822741U/ja
Application granted granted Critical
Publication of JPS635238Y2 publication Critical patent/JPS635238Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1981117854U 1981-08-07 1981-08-07 半導体パツケ−ジ Granted JPS5822741U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981117854U JPS5822741U (ja) 1981-08-07 1981-08-07 半導体パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981117854U JPS5822741U (ja) 1981-08-07 1981-08-07 半導体パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5822741U JPS5822741U (ja) 1983-02-12
JPS635238Y2 true JPS635238Y2 (en]) 1988-02-12

Family

ID=29912006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981117854U Granted JPS5822741U (ja) 1981-08-07 1981-08-07 半導体パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5822741U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045045A (ja) * 1983-08-23 1985-03-11 Shinko Electric Ind Co Ltd 多層セラミックパッケ−ジ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318962A (en) * 1976-08-05 1978-02-21 Nec Corp Semiconductor package
JPS5660038A (en) * 1980-10-20 1981-05-23 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5822741U (ja) 1983-02-12

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